Soft gold MCP/CSP package substrate manufacture supporting

MCP (Multi-Chip Package)
MCP is the structure that increases memory capacity and performance, and maximizes the foot print efficiency by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology.
CSP (Chip Size Package)
CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound , placing solderball pad partly or entirely in lattice-shaped on the opposite side of it. Chip and package have the nearly same size.
It can be applied to apparatus with the small footprint and fast speed in terms of package size and design.

Application:

1. Semi Package
2. Semiconductors
3. Semiconductor
4. IC package
5. IC substrate
6. Smart phone
7. Tablet, IoT devices
8. Infotainment system
9. Notebook PC, etc.

Spec.of pcb production:

Mini.Line space/width:1mil (35um)

Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Short introduction of Horexs Manufacturer:

HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!

Horexs's Products are widely used in IC assembly/IC substrate package, smart card, IC card, Micro SD,Sensor package, eMMC,BGA,UFS,eMCP,uMCP,DDR4,MEMS, small TF card, SD card, SIM card, high voltage circuit breaker, a tablet computer, electronic antenna, tag, microphone, 3D optical technique.

When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality pcb ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Soft Gold CSP Package Substrate

CSP Package Substrate 0.4mm

BT MCP Package Substrate

Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness Images