MEMS package substrate manufacture

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

Country/Region: China

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MEMS package substrate manufacture

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MEMS package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart ...

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