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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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5 Years
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Anylayer/Buildup types Sip packaging Substrate manufacture

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City: Shenzhen
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Anylayer/Buildup types Sip packaging Substrate manufacture

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Anylayer/Buildup types Sip packaging Substrate manufacture

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material brand:Mainly brand:SHENGYI...

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Horexs PCB

      

Gold Plated RAM PCB

      

0.8mm RAM PCB Board

      
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